°³ÀÎȸ¿ø ±â¾÷ȸ¿ø

 º¸¾ÈÁ¢¼Ó
ȸ¿ø°¡ÀÔ £ü ºñ¹øºÐ½Ç

  Quick Menu  
±â¼ú¹®´ä½Ç
¼¾¼­°ü·Ã±â»ç
¼¾¼­¸Å¸ÅÀåÅÍ
¼¾¼­ºÐ·ùÇ¥
°øÁö»çÇ×
ÀÚÁÖÇÏ´Â Áú¹®
Áú¹®´äº¯°Ô½ÃÆÇ

 Events
Çà»ç¾È³»
¼¾¼­°ü·Ã Àü½Ãȸ/¼¼¹Ì³ª/±³À°/À̺¥Æ® ¾È³»ÀÔ´Ï´Ù.
¤ýÁÖÃÖ±â°ü Çѱ¹¹ÝµµÃ¼»ê¾÷Çùȸ, Çѱ¹¹ÝµµÃ¼¿¬±¸Á¶ÇÕ
¤ýȨÆäÀÌÁö http://www.sedex.org
¤ýÇà»ç±â°£ 2004³â9¿ù1ÀÏ~3ÀÏ
¤ýÇà»çÀå¼Ò COEX ´ë¼­¾çȦ
¤ý¹®ÀÇó(´ã´çÀÚ) ÀÌÄ¡¿ì ÆÀÀå, À¯¿µ°Ç ´ë¸®
¤ýÀüÈ­, ¸ÞÀÏ 02-576-3472
¤ý±¸ºÐ Àü½Ãȸ
¤ýÇà»ç±¹°¡ ±¹³»
   
2004 Çѱ¹¹ÝµµÃ¼ µð½ºÇ÷¹ÀÌ»ê¾÷´ëÀü(Semiconductor & Display Exhibition 2004)
ÁÖ°ü : Çѱ¹¹ÝµµÃ¼»ê¾÷Çùȸ

ÈÄ¿ø : °úÇбâ¼úºÎ, »ê¾÷ÀÚ¿øºÎ

Àü½ÃÇ°¸ñ :

¡Û ¹ÝµµÃ¼ ¼ÒÀÚ
Foundries and Contract Manufacturing Services
- Pakaging, Assembly, Wafer Processing or Foundry Service, FPD
. etc
Fabless Houses
Micro Systems Technology
Flat Panel Display(LCD, PDP, Organic EL etc)

¡Û ¹ÝµµÃ¼ Àåºñ
Process Equipment
- Bumping Systems, Ion Implantation Equipment, CVD, PVD, CMP,
Marking Equipment, CMP etc

Assembly Equipment
- Backgrind, Slicing, Polishing, Cleaning, Washing, Dicing, Sawing
. Equipment, Attach Systems etc

Test Equipment
- Burn - In Systems, Failure Analysis Systems, Probers,
FPD Tester / Measurement Equipment, Memory Test Systems,
Package Test Systems, SOC Test Systems etc

Inspection & Measurement Equipment
- Microscopes, Wire Bonding Inspection, Surface Particle Scanners etc

General Equipment
- Cutting / Drilling / Laser Beveling Equipment Repair Equipment,
Vacuum Packaging Equipment, Lamination etc

Flat Panel Display Equipment
- Alignment Film Coating Equipment, Liquid Crystal Injection or
Filling Equipment, Rubbing Equipment, Spacer Spraying
Equipment etc

¡Û ¹ÝµµÃ¼ ¼³ºñºÎ¹®
Air Filtering, Clean Rooms, Flow / Process Control etc

¡Û ¹ÝµµÃ¼ Àç·á
Materials Of Assembly, Chemicals & Solids, Gases, FPD,
Wafer Substrate
- Photomask, Wafer, Lead Frame etc

¡Û ¹ÝµµÃ¼ ºÎÇ°
Sub Systems
- Braking Systems, Cameras, Electron Tube, Pumps, Vacuum etc

Components & Parts
- Bearing, Filters, Sensors, Fittings, O - Rings, Resins, Tubes,
Tube, Motor etc

¡Û ¹ÝµµÃ¼°ü·Ã S/W
CAD, Package Simulation, Test Program etc

  0
3500
¹øÈ£ ±¸ºÐ Çà »ç ¸í Çà»ç±â°£ Á¶È¸
330 Àü½Ãȸ Á¦22ȸ ±¹Á¦ ÀÇ·á±â±â¡¤ÀÇ·áÁ¤º¸Àü½Ãȸ (Ko.. 2006³â3¿ù16ÀÏ~19ÀÏ 1295
329 Àü½Ãȸ ¼¼¹ÌÄÜ ÄÚ¸®¾Æ 2006 (SEMICON KOREA 2006) 2006³â2¿ù8ÀÏ~10ÀÏ 1295
328 Àü½Ãȸ 2005 ´ëÀüÁö´É·Îº¿Àü½Ãȸ 2005³â11¿ù3ÀÏ~6ÀÏ 1294
327 Àü½Ãȸ ±¹Á¦ºÐü»ê¾÷Àü/ ±¹Á¦À¯Ã¼»ê¾÷Àü (POWER KO.. 2006³â4¿ù25ÀÏ~28ÀÏ 1293
326 Àü½Ãȸ ±¹Á¦¸ð¼ÇÄÁÆ®·ÑÀü½Ãȸ(Motion Control Show.. 2006³â10¿ù18ÀÏ~20ÀÏ 1291
325 Àü½Ãȸ 2006 Çѱ¹ÀüÀÚÀü(Korea Electronics Show 2.. 2006³â10¿ù17ÀÏ~21ÀÏ 1289
324 Àü½Ãȸ 2006 ´ëÇѹα¹ ƯÇã±â¼ú´ëÀü(Korea Patent .. 2006³â12¿ù7ÀÏ~11ÀÏ 1288
323 Àü½Ãȸ Á¦1ȸ Çѱ¹±¹Á¦·Îº¿±â¼úÀü(KIROTEC 2004) 2004³â 3¿ù 3ÀÏ ~ 3¿ù 6ÀÏ 1286
322 Àü½Ãȸ ´ëÇѹα¹±â¼ú´ëÀü (New Technology Korea) 2003³â10¿ù17ÀÏ~2003³â10¿ù21ÀÏ 1286
321 Àü½Ãȸ 2004 ±¹Á¦¿ì¼öÀü±âÁ¦Ç°´ëÀü(2004 Internati.. 2004³â12¿ù9ÀÏ~12ÀÏ 1285
320 Àü½Ãȸ 2006 ±¹Á¦·Îº¿ÀÚµ¿È­Àü (International Rob.. 2006³â3¿ù23ÀÏ~26ÀÏ 1283
319 Àü½Ãȸ ·Îº¿ Àü½ÃÀå 2007³â6¿ù22ÀÏ~11¿ù4ÀÏ 1280
318 Àü½Ãȸ ±¹Á¦¹ÝµµÃ¼µð½ºÇ÷¹ÀÌ´ëÀü 2006(Internatio.. 2006³â10¿ù11ÀÏ~13ÀÏ 1280
317 Àü½Ãȸ 2009 â¿ø ±¹Á¦ÀÚµ¿È­Á¤¹Ð±â±âÀü 2009³â5¿ù12ÀÏ~15ÀÏ 1279
316 Àü½Ãȸ Á¦1ȸ ±¹Á¦¹æÀç»ê¾÷Àü(DEMEX 2007) 2007³â5¿ù22ÀÏ~25ÀÏ 1279
315 Àü½Ãȸ IT-SoC Fair 2006 2006³â11¿ù1ÀÏ~2ÀÏ 1279
12345678910,,,27